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IBM

• PowerPC 970

Target Applications

• Audio
• Automotive
• Communication & Wired
• Computers & Peripherals
• Consumer
• Digital Power
• General Purpose
• Imaging & Video
• Industrial
• Medical
• Military & Aerospace
• Mobile & Wireless
• Motor Control
• Security
• Test & Measurement
• Other

IBM

PowerPC 970

Targets: General Purpose

The PowerPC 970 family of processors employ a 64-bit architecture with native 32 –bit application compatibility supported by a high-bandwidth processor bus and a companion bridge chip. These processors support symmetric multiprocessing (SMP) applications for up to four central processing units (CPUs), depending on configuration. The PowerPC 970 processors are lead-reduced products that take advantage of tin-silver-copper (SAC) technology on card connection balls. All module footprints are 25 mm x 25 mm ceramic ball grid array (CBGA) with 1.0 mm ball pitch. The semiconductor chips are fabricated with IBM's advanced, 90 nm copper silicon-on-insulator (SOI) technology.

• More information for IBM PowerPC 970